Master of Science in Information Systems
Technical University of Munich
Duration
2 years
Intake
Summer, Winter.
Degree
Master’s
Program Overview
The Master of Science in Microelectronics and Chip Design in Munich, Germany, is a highly specialized, research-oriented program designed to train future experts in semiconductor technology, integrated circuit (IC) design, and system-on-chip (SoC) solutions. Offered by top universities, such as the Technical University of Munich (TUM), this program prepares students for careers in the fast-growing fields of microelectronics, automotive electronics, and communications technology.
The program covers advanced topics, including analog and digital circuit design, semiconductor device technology, micro- and nanofabrication, embedded systems, and electronic design automation (EDA) tools. Students gain hands-on experience through laboratory courses, design projects, and access to industry-standard chip design tools.
Munich is home to major global semiconductor companies and research centers, providing excellent internship and career opportunities. The program is typically taught in English, attracting an international student body. Graduates are well-prepared for positions in chip development, hardware design, or for pursuing a Ph.D. in microelectronics and related fields.
Key Information
University
Technical University of Munich
Campus
München, Germany
Total Credits
120 ECTS
Study Mode
Full-time
Loan Availability
No
Program Details
Duration
Tuition Fee:
Format
Attendance:
Study Gap:
Fees & Funding:
Course Structure
Semester 1 – Foundations (≈30 ECTS)
Digital & Analog Design Core Courses (approx. 20 ECTS):
Introduction to digital circuit design
Analog and mixed-signal circuit fundamentals
Practical Chip-Design Module (tape-out subproject begins)
Scientific Seminar
Interdisciplinary Modules (e.g., soft skills, management, language tracks)
Semester 2 – Front-End Specialization (≈30 ECTS)
Advanced Front-End Design Courses (SoC integration, verification techniques)
Continued Practical Chip-Design Work (tape-out progression)
Guest Lecture/Advanced Topics Module
Electives in Chip Design or Related Fields
Semester 3 – Back-End & Project Focus (≈30 ECTS)
Back-End Design Courses (physical design, layout, routing)
Chip Tape-Out Project continues to completion.
Specialized Electives (e.g., emerging technologies, EDA tools)
Optional Advanced Practical or Research Module
Semester 4 – Master’s Thesis (30 ECTS)
Master's Thesis & Tape-Out Testing (~6 months)
Thesis typically industry- or research-driven, concluding coursework
Entry Requirement
Academic
Language
IELTS - 6.5
TOEFL - 88
How To Apply
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